Quantum Leap Packaging, Inc., a leading provider of high performance air cavity packages for semiconductor assembly, recently announced that it has added a second manufacturing site in Poway, Calif.
QLP plans to manufacture in its new Poway site by early 2008. The new 18,000 square foot facility will provide QLP with much needed capacity to support growing demand and provide product service and support to its Wilmington, Mass., facility.
“We are pleased to expand our manufacturing capabilities and support our products' rapid growth,” said David Grooms, CEO of QLP. “Our Poway site brings us closer to our customers, ensures that our customers’ orders are delivered on time, and satisfies our need for a second manufacturing site.”
Quantum Leap Packaging, Inc. designs and manufactures high-performance hermetic and near-hermetic air cavity packages for applications such as High Power RF-Microwave Assembly, Image Sensors, Optical Electronics Systems, HB-LEDs, and MEMs.
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