RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio systems and solutions for applications that drive mobile communications, recently announced a major expansion at its Beijing, China, facility. The expansion includes increased assembly capacity and the addition of new advanced capabilities. The expansion is expected to support RFMD’s POLARIS 3 RF solution, which is currently scheduled to ramp production in the current quarter.

The increased capacity will approximately double assembly capabilities related to RFMD’s transmit modules. Capacity of wire bond and test capabilities will be expanded in the current quarter, and full capacity will be available by November 2007. In addition, new advanced capabilities added in RFMD’s Beijing facility will include flip chip packaging technology and the Company’s patent-pending internal RF shielding technology.

RFMD is also developing proprietary RF test platforms internally, as well as working in conjunction with third party suppliers, for advanced transceiver module testing. At completion, the 200,000-square foot expansion and new enabling technologies are expected to streamline RFMD’s supply chain, speed time to market and reduce manufacturing and inventory carrying costs.

“Our Beijing expansion reflects our commitment to support our customers with operational scale, technological innovation and an industry-leading cost structure,” said Bob Bruggeworth, RFMD’s president and CEO. “We expect our Beijing facility expansion will positively impact our ability to meet demand for our POLARIS 3 RF solution, as it ramps in the coming months and grows sequentially throughout calendar year 2008.”

Headquartered in Greensboro, N.C., RFMD has worldwide engineering, design, sales and service facilities.

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